SEALSQ Corp (NASDAQ: LAES) has witnessed a notable surge in its stock performance on the US market today, with SEALSQ stock exhibiting a remarkable uptrend of 31.87%, reaching $2.11 at the latest session check. This positive momentum is attributed to the recent introduction of a groundbreaking service by SEALSQ.
In a formal announcement, SEALSQ (LAES) unveiled an expansion of its “on-wafer” semiconductor provisioning offering, introducing a novel “on-Package” chip personalization service with a reduced lead time of just four weeks. This innovative service empowers SEALSQ to provide clients the option to customize off-the-shelf secure elements from its VaultIC range with certificates and keys.
The pre-loaded chips, available in quantities ranging from 1,000 to 20,000 units, can be delivered within a swift four-week timeframe. SEALSQ’s agility in adapting to market demands by swiftly launching new products with accelerated time-to-market aims to cater to the needs of IoT device manufacturers engaged in small-batch production before scaling up.
At the core of SEALSQ’s value proposition is its commitment to being a vertically integrated security provider. This entails the ability to pre-provision its secure element range with private keys and certificates compliant with protocols like MATTER, Wi-SUN, or OPC. This ensures seamless authentication and commissioning, particularly with major cloud platforms such as Microsoft AZURE or AWS Clouds.
Traditionally, chip personalization in the semiconductor industry occurs at an early production stage, involving substantial order volumes and several months of lead time before delivery. SEALSQ disrupts this norm by offering a last-minute personalization service through its VaultITrust personalization platform.
Furthermore, certificate issuance and management are facilitated using SEALSQ’s Managed PKI-as-a-Service platform (INeS). This platform empowers device manufacturers to generate and manage compliant certificates throughout a device’s lifecycle through a user-friendly and potent interface.
SEALSQ’s Provisioning-on-Package service innovation aligns with the industry’s evolution, marked by the release of the Matter specification a year prior. It serves as an exemplary instance of how adherence to standards has rapidly evolved, introducing advanced secure element support with improved speed-to-market. This innovation holds the potential to reduce costs for manufacturers of Smart Home devices.